Slash cooling costs by transferring heat from servers while reducing or eliminating the need for air conditioning. Heat transfer media are non-hazardous, electrically insulating, and non-flammable, eliminating the risk of short-circuits, electrical shock, and equipment damage that can occur in the event of a leak with water-cooled systems. Cold plates from multiple servers and racks can be manifolded to a common condenser mounted outside the rack room, simplifying the installation and reducing costs.

Passive cooling eliminates the need for noisy high-speed fans for CPUs and graphics cards, allowing near-silent operation. Achieve the cooling performance of in-case liquid-cooled systems, without the risks associated with water, and more reliably than with pumped units.

Phase-changing non-conductive coolants eliminate the need and maintenance requirements of deionized-water cooling loops. Dramatically reduce the size and weight of cooling/chiller system auxiliaries while reducing electrical power requirements, for more compact and efficient laser systems.